Assembly Customer Facing Program Manager
- Test Operations Department
- Penang, Malaysia
Job Description
We are looking for an experienced Assembly Customer Facing Program Manager to serve as the key liaison between our wafer sort operations and customers. This role is ideal for someone with strong technical expertise in semiconductor assembly and a passion for driving operational excellence while ensuring customer satisfaction.
Roles and Responsibilities
- Will be responsible to oversee and drive progress of wafer sort test operations and output
- Will be the single point contact to all wafer sort customer requests covering planning, technical requirements, operational updates including output, quality and issues
- Will be the coordinator of internal teams to support customer requests
Qualification
- Assembly background with 5-10 years’ experience and possess expertise in WLCSP, FCBGA and QFN (flip chip/ wire bond) assembly processes
- Deep understanding of assembly line setup, process flow, and yield improvement for these technologies
- Proven ability to troubleshoot complex manufacturing issues related to these packages, including defect analysis and root cause identification
- Strong background in implementing corrective actions based on customer feedback and internal quality metrics
- Proactive in continuous process improvement to meet customer expectations and contractual requirements
- Knowledge of industry standards and best practices in semiconductor assembly
- Can read/write/speak fluent English and Mandarin (for engaging with China and Taiwan companies)
- Good presentation and communication skills